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AI-1531

AI-1531


Application
Liquid Encapsulant, Bonding Adhesive

Recommended Cure Condition
20 minutes @ 60°C (Conventional Convection Oven) OR 3 minutes @ 100°C (Hot Plate)

Viscosity
21,000 cps











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Application
Liquid Encapsulant, Bonding Adhesive

Recommended Cure Condition
20 minutes @ 60°C (Conventional Convection Oven) OR 3 minutes @ 100°C (Hot Plate)

Viscosity
21,000 cps