Application
Liquid Encapsulant, Bonding Adhesive
Recommended Cure Condition
20 minutes @ 60°C (Conventional Convection Oven) OR 3 minutes @ 100°C (Hot Plate)
Viscosity
21,000 cps
Application
Liquid Encapsulant, Bonding Adhesive
Recommended Cure Condition
20 minutes @ 60°C (Conventional Convection Oven) OR 3 minutes @ 100°C (Hot Plate)
Viscosity
21,000 cps