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IPRODUCT / 經(jīng)營項(xiàng)目

TU-1928

Application
Underfill for BGA and CSP

Recommended Cure Condition
30 minutes @ 95°C (Conventional Convection Oven)

Viscosity
1,300 cps

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Application
Underfill for BGA and CSP

Recommended Cure Condition
30 minutes @ 95°C (Conventional Convection Oven)

Viscosity
1,300 cps