AD-1384
Product Description
MATT AD-1384 is one component liquid epoxy adhesive, which has low temperature curability. It is designed to absorb impact stress using a unique toughing agent and
provide excellent adhesion to various substrates.
Typical Application
Bonding Adhesive
Property of Uncured Material
Color Black
Specific Gravity 1.24
Viscosity (Brookfield C&P HBDV-II,
Spindle #51, 25°C) 5 RPM 17,000 cps
Thixotropic Index 6.8
Work Life @ 25°C, days 3
Shelf Life @ -15°C, months 6
Physical Properties
Gel Time @ 100°C, Hot plate 25 S
Hardness (Shore D) 67
Glass Transition Temperature (Tg) 31 °C
Coefficient of Thermal Expansion
Below Tg 75 ppm/°C
Above Tg 207 ppm/°C
Moisture Absorption
(100°C / 100%, 1 hr) 0.91%
Volume Cure Shrinkage 0.78 %
Young’s Modulus by DMA @25°C 1,605Mpa
Water Absorption 1.24 %
(100°C / 100%, 1 hr)
Shear strength (PCB to Housing)
LCP (10N) 8.0 kgf
PA9T (1300G) 7.5 kgf
PC (GF 30%) 12.5 kgf
Product Description
MATT AD-1384 is one component liquid epoxy adhesive, which has low temperature curability. It is designed to absorb impact stress using a unique toughing agent and
provide excellent adhesion to various substrates.
Typical Application
Bonding Adhesive
Property of Uncured Material
Color Black
Specific Gravity 1.24
Viscosity (Brookfield C&P HBDV-II,
Spindle #51, 25°C) 5 RPM 17,000 cps
Thixotropic Index 6.8
Work Life @ 25°C, days 3
Shelf Life @ -15°C, months 6
Physical Properties
Gel Time @ 100°C, Hot plate 25 S
Hardness (Shore D) 67
Glass Transition Temperature (Tg) 31 °C
Coefficient of Thermal Expansion
Below Tg 75 ppm/°C
Above Tg 207 ppm/°C
Moisture Absorption
(100°C / 100%, 1 hr) 0.91%
Volume Cure Shrinkage 0.78 %
Young’s Modulus by DMA @25°C 1,605Mpa
Water Absorption 1.24 %
(100°C / 100%, 1 hr)
Shear strength (PCB to Housing)
LCP (10N) 8.0 kgf
PA9T (1300G) 7.5 kgf
PC (GF 30%) 12.5 kgf