AD-1331CN
Product Description
MATT AD-1331CN is one component liquid epoxy adhesive, which has hotplate curability for better productivity of image sensor device. It is designed for bonding component providing excellent adhesion to various substrates.
Typical Application
Liquid Encapsulant, Bonding Adhesive
Property of Uncured Material
Color：Black
Specific Gravity：1.38
Viscosity Brookfield C&P HBDV-II,Spindle #51, 25°C) 5 RPM 7,300 cps
Thixotropic Index 4.2
Work Life @ 25°C, days 1
Shelf Life @ -15°C, months 6
Physical Properties
Gel Time @ 100°C, Hot plate 20 S
Hardness (Shore D) 80
Glass Transition Temperature (Tg) 47°C
Coefficient of Thermal Expansion
Below Tg 64 ppm/°C
Above Tg 165 ppm/°C
Moisture Absorption 0.88 %
(100°C / 100%, 1 hr)
Volume Cure Shrinkage 0.93 %
Recommended Cure Condition
40 seconds @ 120°C (Hot Plate) OR
20 minutes @ 60°C (Conventional Convection Oven)
Product Description
MATT AD-1331CN is one component liquid epoxy adhesive, which has hotplate curability for better productivity of image sensor device. It is designed for bonding component providing excellent adhesion to various substrates.
Typical Application
Liquid Encapsulant, Bonding Adhesive
Property of Uncured Material
Color：Black
Specific Gravity：1.38
Viscosity Brookfield C&P HBDV-II,Spindle #51, 25°C) 5 RPM 7,300 cps
Thixotropic Index 4.2
Work Life @ 25°C, days 1
Shelf Life @ -15°C, months 6
Physical Properties
Gel Time @ 100°C, Hot plate 20 S
Hardness (Shore D) 80
Glass Transition Temperature (Tg) 47°C
Coefficient of Thermal Expansion
Below Tg 64 ppm/°C
Above Tg 165 ppm/°C
Moisture Absorption 0.88 %
(100°C / 100%, 1 hr)
Volume Cure Shrinkage 0.93 %
Recommended Cure Condition
40 seconds @ 120°C (Hot Plate) OR
20 minutes @ 60°C (Conventional Convection Oven)