AD-4001FS
Product Description
MATT DA-4001FS is one component epoxy adhesive, which has high shear strength with image sensor die during high temperature bonding process such as hotbar or ACF bonding. It is designed to have high T.I and viscosity to prevent die rotation or tilt problem.
Typical Application
Die Attach Adhesive
Property of Material
Color Pink
Specific Gravity 1.50
Viscosity (Brookfield C&P HBDV-II,
Spindle #51, 25°C) 5 RPM 20,000 cps
Thixotropic Index 3.3
Work Life @ 25°C, days 1
Shelf Life @ -15°C, months 6
Physical Properties
Gel Time @ 150°C, Hot plate 9S
Hardness (Shore D) 83
Glass Transition Temperature (Tg) 55 °C
Coefficient of Thermal Expansion
Below Tg 71 ppm/°C
Above Tg 143 ppm/°C
Moisture Absorption 0.75 %
(100°C / 100%, 1hr)
Volume Cure Shrinkage 0.61 %
Die Shear Adhesion
Si die (3mm x 3mm) to FR4 PCB
@ 25°C 37 kgf
@ 230°C 3.2 kgf
Product Description
MATT DA-4001FS is one component epoxy adhesive, which has high shear strength with image sensor die during high temperature bonding process such as hotbar or ACF bonding. It is designed to have high T.I and viscosity to prevent die rotation or tilt problem.
Typical Application
Die Attach Adhesive
Property of Material
Color Pink
Specific Gravity 1.50
Viscosity (Brookfield C&P HBDV-II,
Spindle #51, 25°C) 5 RPM 20,000 cps
Thixotropic Index 3.3
Work Life @ 25°C, days 1
Shelf Life @ -15°C, months 6
Physical Properties
Gel Time @ 150°C, Hot plate 9S
Hardness (Shore D) 83
Glass Transition Temperature (Tg) 55 °C
Coefficient of Thermal Expansion
Below Tg 71 ppm/°C
Above Tg 143 ppm/°C
Moisture Absorption 0.75 %
(100°C / 100%, 1hr)
Volume Cure Shrinkage 0.61 %
Die Shear Adhesion
Si die (3mm x 3mm) to FR4 PCB
@ 25°C 37 kgf
@ 230°C 3.2 kgf